Inventor · disambiguated record
Hyungjun Jeon
Also filed as: JEON HYUNGJUN
16 granted patents·7 pending applications·9 citations·filing 2014–2024
87Inventor score
Top patents by PatentIndex Score
23 records- 0194US11749586B2Semiconductor device including through via structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 5, 2023·3 cites·20 claims
- 0279US9496163B2Carrier and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 15, 2016·4 cites·20 claims
- 0374US10689432B2B7X and its derivatives for treating and preventing cardiovascular diseaseALBERT EINSTEIN COLLEGE MEDICINE·Filed 2014·Granted Jun 23, 2020·1 cites·3 claims
- 0470US12456631B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·20 claims
- 0570US12300671B2Semiconductor packages and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 0670US10651074B2Substrate processing apparatus and method of manufacture using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 12, 2020·1 cites·20 claims
- 0770US2024153851A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0869US12046538B2Semiconductor device including through via structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 0966US12476234B2Semiconductor device including through electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 1066US11908775B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·11 claims
- 1164US11694980B2Semiconductor stack and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·9 claims
- 1263US11315894B2Semiconductor stack and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·21 claims
- 1363US2025349731A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1460US11721562B2Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·8 claims
- 1559US11810900B2Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·18 claims
- 1659US2025157983A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1759US2025038149A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1856US2024234251A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1955US2024047305A1Integrated circuit semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2052US11804419B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 2148US2022367321A1Semiconductor device including through electrode and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2247US9399822B2Liquid compositions and methods of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 26, 2016·0 cites·18 claims
- 2344US9922897B1Method of manufacturing semiconductor packageKIM KYOUNG HWAN·Filed 2017·Granted Mar 20, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →