Inventor · disambiguated record
Hyung Jun Jeon
Also filed as: JEON HYUNG JUN
19 granted patents·7 pending applications·191 citations·filing 2006–2025
93Inventor score
Top patents by PatentIndex Score
26 records- 0198US7537962B2Method of fabricating a shielded stacked integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted May 26, 2009·78 cites·18 claims
- 0297US10153219B2Fan out wafer level package type semiconductor package and package on package type semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 11, 2018·52 cites·20 claims
- 0386US9691685B2Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 27, 2017·4 cites·20 claims
- 0485US7485502B2Integrated circuit underfill package systemSTATS CHIPPAC LTD·Filed 2006·Granted Feb 3, 2009·13 cites·10 claims
- 0584US8018040B2Shielded stacked integrated circuit packaging system and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Sep 13, 2011·9 cites·16 claims
- 0682US10580726B2Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 3, 2020·3 cites·20 claims
- 0779US8451125B2Reader based on RFIDHONG JIN KUK·Filed 2010·Granted May 28, 2013·7 cites·4 claims
- 0879US7741726B2Integrated circuit underfill package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jun 22, 2010·8 cites·9 claims
- 0978US8537881B2Method and apparatus for detecting offset signal of transmission leakage signal in RF transceiverCHOI HEON SOO·Filed 2011·Granted Sep 17, 2013·7 cites·10 claims
- 1068US2025210529A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1167US9107143B2Apparatus and method for connecting access point in portable terminalKIM JONG-SEOK·Filed 2011·Granted Aug 11, 2015·2 cites·12 claims
- 1266US12266609B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·19 claims
- 1364US8742930B2Gate systemHONG JIN KUK·Filed 2011·Granted Jun 3, 2014·3 cites·9 claims
- 1464US8368200B2Shielded stacked integrated circuit packaging system and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2011·Granted Feb 5, 2013·1 cites·16 claims
- 1563US7705475B2Integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Apr 27, 2010·2 cites·8 claims
- 1660US2024379639A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1758US8114771B2Semiconductor wafer scale package systemJEON HYUNG JUN·Filed 2006·Granted Feb 14, 2012·2 cites·10 claims
- 1857US2024186247A1Semiconductor device and method for manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1946US11728200B2Wafer bonding apparatusesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 15, 2023·0 cites·20 claims
- 2044US8633056B2Integrated circuit package system and method of manufacture thereofJEON HYUNG JUN·Filed 2010·Granted Jan 21, 2014·0 cites·18 claims
- 2142US2014145327A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2240US2007001296A1Bump for overhang deviceSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
- 2339US2013009755A1Rfid antenna system and method for controlling the sameLSIS CO LTD·Filed 2012·Application pending·0 cites
- 2439US2012077529A1Apparatus and method for updating data in portable terminalKIM JONG-SEOK·Filed 2011·Application pending·0 cites
- 2535US8400229B2Vector modulator using time delay and phase shifterCHOI HEON SOO·Filed 2011·Granted Mar 19, 2013·0 cites·6 claims
- 2630US8588337B2Vector modulatorCHOI HEON SOO·Filed 2011·Granted Nov 19, 2013·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →