Inventor · disambiguated record
Hyung Jin Jeon
Also filed as: JEON HYUNG JIN
27 granted patents·20 pending applications·135 citations·filing 1996–2022
95Inventor score
Files withSAMSUNG ELECTRO MECH28LG ELECTRONICS INC5PARK SEUNG WOOK4JEON HYUNG JIN3HYUNDAI MOTOR CO LTD2
Top patents by PatentIndex Score
47 records- 0192US7663250B2Wafer level package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 16, 2010·26 cites·12 claims
- 0290US6314066B1Method for controlling track jump in optical recording mediumLG ELECTRONICS INC·Filed 2000·Granted Nov 6, 2001·31 cites·16 claims
- 0383US9966179B2Common mode filter for improving magnetic permeability and high frequency characteristicsSAMSUNG ELECTRO MECH·Filed 2016·Granted May 8, 2018·2 cites·10 claims
- 0483US9928953B2Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Mar 27, 2018·3 cites·14 claims
- 0583US8704350B2Stacked wafer level package and method of manufacturing the samePARK SEUNG WOOK·Filed 2009·Granted Apr 22, 2014·11 cites·5 claims
- 0683US8658467B2Method of manufacturing stacked wafer level packagePARK SEUNG WOOK·Filed 2011·Granted Feb 25, 2014·7 cites·8 claims
- 0782US11342110B2InductorSAMSUNG ELECTRO MECH·Filed 2018·Granted May 24, 2022·2 cites·24 claims
- 0878US8143099B2Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layerPARK SEUNG WOOK·Filed 2009·Granted Mar 27, 2012·8 cites·12 claims
- 0977US9173291B2Circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 27, 2015·3 cites·31 claims
- 1077US7632709B2Method of manufacturing wafer level packageSAMSUNG ELECTRO MECH·Filed 2008·Granted Dec 15, 2009·7 cites·6 claims
- 1177US6747932B1Apparatus and method for detecting non-recording regions of an optical recording mediumLG ELECTRONICS INC·Filed 2000·Granted Jun 8, 2004·12 cites·15 claims
- 1275US8299692B2Light emitting device package and method of manufacturing the sameLEE YOUNG KI·Filed 2008·Granted Oct 30, 2012·5 cites·15 claims
- 1374US7947530B2Method of manufacturing wafer level package including coating and removing resin over the dicing linesSAMSUNG ELECTRO MECH·Filed 2009·Granted May 24, 2011·5 cites·6 claims
- 1472US12023732B2Iron-based mixed powder and method for manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·5 claims
- 1569US9196506B2Method for manufacturing interposerSAMSUNG ELECTRO MECH·Filed 2012·Granted Nov 24, 2015·2 cites·8 claims
- 1666US7012861B1Track jump method for a recording mediumLG ELECTRONICS INC·Filed 2000·Granted Mar 14, 2006·6 cites·30 claims
- 1764US11538620B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Dec 27, 2022·0 cites·14 claims
- 1861US11763970B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Sep 19, 2023·0 cites·19 claims
- 1959US11935682B2Coil component and manufacturing method for the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 19, 2024·0 cites·13 claims
- 2059US7960806B2Sub-mount, light emitting diode package and manufacturing method thereofSAMSUNG LED CO LTD·Filed 2008·Granted Jun 14, 2011·1 cites·7 claims
- 2156US11820587B2Hopper for raw material powder and method for transferring raw material powder by using sameHYUNDAI MOTOR CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·12 claims
- 2256US9609183B2Camera module and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Mar 28, 2017·0 cites·19 claims
- 2353US2011062533A1Device package substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2452US9257615B2Light emitting device package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Feb 9, 2016·0 cites·28 claims
- 2552US7315492B2Header mask signal generating track jump method for a recording mediumLG ELECTRONICS INC·Filed 2005·Granted Jan 1, 2008·0 cites·9 claims
- 2652US2014251657A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2752US2011061911A1Interposer and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2849US2012261816A1Device package substrate and method of manufacturing the samePARK SEUNG WOOK·Filed 2012·Application pending·0 cites
- 2949US2015000958A1Printed circuit board and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3048US2011045668A1Method of manufacturing wafer level device packageSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3147US2010149770A1Semiconductor stack packageSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3246US2009253259A1Solder ball attachment jig and method for manufacturing semiconductor device using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3346US2011201156A1Method of manufacturing wafer level package including coating resin over the dicing linesSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 3445US2009302468A1Printed circuit board comprising semiconductor chip and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3545US2015054692A1Antenna module and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3645US2009166862A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3745US2013149437A1Method for manufacturing printed circuit boardOH KYUNG SEOB·Filed 2012·Application pending·0 cites
- 3845US2013153266A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 3943US2013153275A1Printed circuit board and method for manufacturing the sameHYUN JIN GUL·Filed 2012·Application pending·0 cites
- 4042US8756804B2Method of manufacturing printed circuit boardJEON HYUNG JIN·Filed 2011·Granted Jun 24, 2014·0 cites·5 claims
- 4141US2014042604A1Three-dimensional (3d) semiconductor packageSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 4240US2018061553A1Chip electronic component including stress buffer layerSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 4339US2017330675A1Common mode filterSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 4438US8106308B2Printed circuit board for package and manufacturing method thereofJEON HYUNG-JIN·Filed 2007·Granted Jan 31, 2012·0 cites·11 claims
- 4535US5845014ACircuit for deciding DCT block classesLG ELECTRONICS INC·Filed 1996·Granted Dec 1, 1998·4 cites·3 claims
- 4635US2016149305A1Antenna device and near field communication device including the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 4732US2012012378A1Printed circuit board and method of manufacturing the sameJEON HYUNG JIN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →