Inventor · disambiguated record
Hyeon Jun Jin
Also filed as: JIN HYEON JUN
0 granted patents·2 pending applications·0 citations·filing 2023–2025
Files withSAMSUNG ELECTRONICS CO LTD2
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2 records- 0156US2024178188A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0247US2025349570A1Semiconductor package molding apparatus, semiconductor package molding system and semiconductor molding methodSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →