Inventor · disambiguated record
Hyeyeong Jo
Also filed as: JO HYEYEONG
2 granted patents·2 pending applications·0 citations·filing 2020–2024
26Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0153US12469775B2Semiconductor package including substrate having a dummy pattern between padsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·16 claims
- 0251US2025054774A1Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0347US11417595B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·18 claims
- 0437US2023019350A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →