Inventor · disambiguated record
Hyunsu Jun
Also filed as: JUN HYUNSU
14 granted patents·2 pending applications·60 citations·filing 2015–2022
88Inventor score
Top patents by PatentIndex Score
16 records- 0197US10177188B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 8, 2019·41 cites·17 claims
- 0287US11252308B2Camera module and imaging apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 15, 2022·2 cites·20 claims
- 0385US11392012B2Multi-input folded camera and mobile device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 19, 2022·2 cites·20 claims
- 0484US10008533B2Semiconductor packageJUN HYUNSU·Filed 2016·Granted Jun 26, 2018·8 cites·20 claims
- 0581US11380726B2Sensor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 5, 2022·1 cites·20 claims
- 0680US11482554B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·1 cites·11 claims
- 0777US9966401B2Package for image sensor with outer and inner framesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 8, 2018·3 cites·20 claims
- 0874US11086099B2Light-folding camera and mobile device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 10, 2021·1 cites·20 claims
- 0972US11914271B2Multi-input folded camera and mobile device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 27, 2024·0 cites·20 claims
- 1071US10868073B2Method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 15, 2020·1 cites·18 claims
- 1157US11563874B2Camera module and imaging apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 24, 2023·0 cites·19 claims
- 1252US11218651B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·17 claims
- 1339US9634046B2Semiconductor packages including electrical insulation featuresSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 25, 2017·0 cites·15 claims
- 1436US11949975B2Camera module and imaging apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 2, 2024·0 cites·16 claims
- 1535US2017179182A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1632US2016005778A1Semiconductor Package and Method for Manufacturing the SameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →