Inventor · disambiguated record
Hyungsuk Jung
Also filed as: JUNG HYUNGSUK
13 granted patents·34 pending applications·45 citations·filing 2014–2025
87Inventor score
Top patents by PatentIndex Score
47 records- 0194US10461167B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 29, 2019·18 cites·20 claims
- 0291US9190272B1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 17, 2015·22 cites·16 claims
- 0380US9502406B1Semiconductor device and method of fabricating the samePARK CHEOLWOO·Filed 2015·Granted Nov 22, 2016·4 cites·17 claims
- 0476US12021080B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 0575US2024209495A1Deposition system and processing systemSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0674US2025279262A1Batch-type apparatus for atomic layer etching (ale), and ale method and semiconductor device manufacturing method based on the same apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0773US11121131B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·1 cites·20 claims
- 0872US2024363678A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0971US2025287619A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1070US12057470B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 1169US11742351B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 1267US12507397B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 1367US12336202B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 1467US2025137123A1Multi-component thin film, method of manufacturing the same, and ic device including the multi-component thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1566US12334308B2Batch-type apparatus for atomic layer etching (ALE), and ALE method and semiconductor device manufacturing method based on the same apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·19 claims
- 1663US2022033962A1Deposition system and processing systemSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1763US2025212489A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1862US2025169062A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1961US11557656B2Semiconductor device having a capping pattern on a gate electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 17, 2023·0 cites·19 claims
- 2061US2025188607A1Method of manufacturing thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2159US2025194099A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2259US2024349511A1Capacitor and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2359US2024321943A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2458US2025192006A1Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2558US2024389348A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2658US2025212425A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2758US2024213302A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2858US2024237332A1Semiconductor device including capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2956US2024315045A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3056US2024072105A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3156US2024072106A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3256US2024096931A1Capacitor structure, method of forming the same, and semiconductor device including the capacitor structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3355US2024021427A1Method of forming film and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3455US2024292596A1Semiconductor device including capacitor and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3554US2024099017A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3654US2024105765A1Capacitor structure and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3753US2024030024A1Layer deposition method and layer deposition apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3853US2023380141A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3953US2024162281A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4053US2023413522A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4152US2023363142A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4252US2023320075A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4352US2023290811A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4452US2024074150A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4551US10811505B2Gate electrode having upper and lower capping patternsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·16 claims
- 4646US2023217647A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4733US10079186B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 18, 2018·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →