Inventor · disambiguated record
Hyunjae Kang
Also filed as: KANG HYUNJAE
15 granted patents·11 pending applications·22 citations·filing 2015–2024
88Inventor score
Top patents by PatentIndex Score
26 records- 0191US12119891B2Contactless card reading employing gain and attenuation controlSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·2 cites·16 claims
- 0291US11671147B2Contactless card reading employing gain and attenuation controlSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 6, 2023·2 cites·20 claims
- 0387US9466721B1Semiconductor device having stressor and method of fabricating the sameKIM JINBUM·Filed 2015·Granted Oct 11, 2016·9 cites·20 claims
- 0482US11955387B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 9, 2024·1 cites·10 claims
- 0579US11283483B2Contactless card reading employing gain and attenuation controlSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·1 cites·17 claims
- 0676US9948336B2Communication circuit chip and electronic device configured to communicate with plural memory cardsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 17, 2018·3 cites·18 claims
- 0773US12224214B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 11, 2025·0 cites·10 claims
- 0873US9536118B2Card reader and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 3, 2017·2 cites·20 claims
- 0962US10177944B2Communication circuit chip and electronic device configured to decode data with reference to reception characteristic analyzed based on start-of-frame patternSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 8, 2019·1 cites·15 claims
- 1059US2025054822A1Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1159US2025107190A1Semiconductor devices including substrate structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1258US10212576B2Near field communication deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 19, 2019·1 cites·20 claims
- 1357US2024321726A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1456US2025227995A1Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1555US12341045B2Parallel transfer apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·18 claims
- 1655US2024294196A1Overhead hoist transport systemSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1755US2025006654A1Semiconductor device having test patternSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1855US2024253900A1Article transfer and storage apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1955US2024317492A1Distribution storage systemSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2054US2024327136A1Apparatus for transferring carriersSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2152US12437998B2Method of manufacturing integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 2252US2023056749A1Intrusion detection and prevention solution system in iot network using explainable aiUNIV KOREA RES & BUS FOUND·Filed 2022·Application pending·0 cites
- 2351US10204243B2Card reader and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 12, 2019·0 cites·17 claims
- 2451US2023326777A1Semiconductor carrier storage system, semiconductor fabrication system including the same, and semiconductor fabrication method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2550US12387759B2Cassette storage case and cassette management system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·19 claims
- 2642US11190237B2Wireless communication device for detecting cardSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 30, 2021·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →