Inventor · disambiguated record
Hyeongmun Kang
Also filed as: KANG HYEONGMUN
10 granted patents·3 pending applications·6 citations·filing 2013–2024
80Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD13
Top patents by PatentIndex Score
13 records- 0186US11257794B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 22, 2022·2 cites·20 claims
- 0280US11257725B2Semiconductor package including test bumpsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 22, 2022·1 cites·20 claims
- 0379US11721601B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·1 cites·21 claims
- 0467US9035308B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 19, 2015·2 cites·20 claims
- 0565US11658160B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·0 cites·20 claims
- 0664US12125753B2Semiconductor package including test bumpsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 0752US2024290754A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0852US2024321831A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0949US11756935B2Chip-stacked semiconductor package with increased package reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·19 claims
- 1049US11469099B2Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·18 claims
- 1143US12230575B2Carrier structure including pockets for accommodating semiconductor chip stack structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 1242US12463105B2Semiconductor package including a dummy chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·13 claims
- 1341US2014103517A1Package substrate structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →