Inventor · disambiguated record
Hyo Chan Kim
Also filed as: KIM HYO C · KIM HYO CHAN
9 granted patents·2 pending applications·25 citations·filing 2004–2018
82Inventor score
Top patents by PatentIndex Score
11 records- 0191US10720678B2Indirect cooling system capable of uniformly cooling battery modules and battery pack including the sameLG CHEMICAL LTD·Filed 2016·Granted Jul 21, 2020·6 cites·20 claims
- 0278US11046206B2Battery module with short-circuit unit, and battery pack and vehicle including the sameLG CHEMICAL LTD·Filed 2018·Granted Jun 29, 2021·1 cites·7 claims
- 0376US10522803B2Battery pack including coupling member having assembling guide functionLG CHEMICAL LTD·Filed 2017·Granted Dec 31, 2019·1 cites·13 claims
- 0476US7600547B2Variable lamination rapid prototyping apparatus for producing large scale 3-dimensional objectKOREA ADVANCED INST SCI & TECH·Filed 2005·Granted Oct 13, 2009·10 cites·1 claims
- 0576US7303385B2Heating tool for shaping soft materials and shaping apparatus using the sameKOREA ADVANCED INST SCI & TECH·Filed 2005·Granted Dec 4, 2007·6 cites·16 claims
- 0656US7527491B2Rotary hot tool and heat ablation apparatus using the sameKOREA ADVANCED INST SCI & TECH·Filed 2006·Granted May 5, 2009·1 cites·10 claims
- 0755US11121434B2Battery module and battery pack and vehicle comprising the sameLG CHEMICAL LTD·Filed 2018·Granted Sep 14, 2021·0 cites·10 claims
- 0848US2005238794A1Method and apparatus for coloring three-dimensional objectKOREA ADVANCED INST SCI & TECH·Filed 2005·Application pending·0 cites
- 0945US11011802B2Battery module with short-circuit unit, and battery pack and vehicle including sameLG CHEMICAL LTD·Filed 2018·Granted May 18, 2021·0 cites·12 claims
- 1041US2005017411A1Three-dimensional shaping apparatus and method using non-contact type heating toolFiled 2004·Application pending·0 cites
- 1139US10586952B2Battery module comprising cartridge having gripping partLG CHEMICAL LTD·Filed 2016·Granted Mar 10, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →