Inventor · disambiguated record
Hyoung Ho Kim
Also filed as: KIM HYOUNG · KIM HYOUNG H · KIM HYOUNG HO
15 granted patents·6 pending applications·129 citations·filing 2002–2022
92Inventor score
Top patents by PatentIndex Score
21 records- 0194US7453093B2LED package and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Nov 18, 2008·28 cites·9 claims
- 0290US7644480B2Method for manufacturing multilayer chip capacitorSAMSUNG ELECTRO MECH·Filed 2007·Granted Jan 12, 2010·20 cites·6 claims
- 0386US7371603B2Method of fabricating light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2006·Granted May 13, 2008·14 cites·9 claims
- 0479US7251119B2Multilayer chip capacitor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Jul 31, 2007·9 cites·4 claims
- 0578US10536120B2Multi-path communication device for sharing feedback path for digital pre-distortionSOLID INC·Filed 2016·Granted Jan 14, 2020·3 cites·4 claims
- 0675US8012778B2LED package and fabricating method thereofSAMSUNG LED CO LTD·Filed 2008·Granted Sep 6, 2011·5 cites·9 claims
- 0774US7203055B2Method of manufacturing multilayered ceramic capacitor by spin coating and multilayered ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2004·Granted Apr 10, 2007·22 cites·49 claims
- 0868US8709832B2Chip on film (COF) package having test line for testing electrical function of chip and method for manufacturing sameKIM HYOUNG-HO·Filed 2011·Granted Apr 29, 2014·4 cites·8 claims
- 0967US10763795B2Multi-path communication device for sharing feedback path for digital pre-distortionSOLID INC·Filed 2019·Granted Sep 1, 2020·1 cites·6 claims
- 1065US7442968B2Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Oct 28, 2008·11 cites·7 claims
- 1165US6853090B2TAB tape for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 8, 2005·12 cites·36 claims
- 1254US9603236B2Heat dissipating substrateSAMSUNG ELECTRO MECH·Filed 2014·Granted Mar 21, 2017·0 cites·9 claims
- 1350US2011188694A1variable directional microphone assembly and method of making the microphone assemblyLEE SANG-HO·Filed 2008·Application pending·0 cites
- 1449US2009107616A1Manufacturing method of multi-layer ceramic substrateSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1545US8753462B2Method of manufacturing non-shrinking multilayer ceramic substrateCHO BEOM JOON·Filed 2009·Granted Jun 17, 2014·0 cites·14 claims
- 1645US2008317274A1Apparatus for Necklace Type Radio HeadsetUBIXON CO LTD·Filed 2006·Application pending·0 cites
- 1744US2009050887A1Chip on film (cof) package having test pad for testing electrical function of chip and method for manufacturing sameKIM HYOUNG-HO·Filed 2008·Application pending·0 cites
- 1842US11206599B2Main unit and distributed antenna system including the sameSOLID INC·Filed 2018·Granted Dec 21, 2021·0 cites·4 claims
- 1942US2006121258A1Sol composition for dielectric ceramic, and dielectric ceramic and multilayered ceramic capacitor using the sameSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 2040US2023249994A1Controllable advanced decomposition equipment for industrial process-water containing non-biodegradable organics and in-organicsYOONJIN ENV CO LTD·Filed 2022·Application pending·0 cites
- 2138US7338854B2Method for manufacturing multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2004·Granted Mar 4, 2008·0 cites·40 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →