Inventor · disambiguated record
Hyosung Koo
Also filed as: KOO HYOSUNG
1 granted patent·3 pending applications·0 citations·filing 2016–2024
13Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0152US2025253302A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0244US2023230952A1Wire clamp and wire bonding apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0336US10643966B2Electrical interconnections for semiconductor devices and methods for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 5, 2020·0 cites·5 claims
- 0429US2017179065A1Electrical interconnections for semiconductor devices and methods for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →