Inventor · disambiguated record
Hye Ji Lee
Also filed as: LEE HYE JI
12 granted patents·5 pending applications·51 citations·filing 2018–2023
87Inventor score
Files withCJ CHEILJEDANG CORP8LG CHEMICAL LTD3MAGNACHIP SEMICONDUCTOR LTD2SAMSUNG ELECTRONICS CO LTD2LG ENERGY SOLUTION LTD1
Top patents by PatentIndex Score
17 records- 0191USD1008040SPackaging sleeve for foodstuffsCJ CHEILJEDANG CORP·Filed 2022·Granted Dec 19, 2023·15 cites·1 claims
- 0291USD1000284SPackaging sleeve for foodstuffsCJ CHEILJEDANG CORP·Filed 2022·Granted Oct 3, 2023·15 cites·1 claims
- 0374US12154632B2Semiconductor memory device and storage system including semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 0466US2024101738A1Ethylene/Alpha-Olefin Copolymer and Composition for Encapsulant Film Comprising the SameLG CHEMICAL LTD·Filed 2022·Application pending·0 cites
- 0561USD997736SBag for food packingCJ CHEILJEDANG CORP·Filed 2022·Granted Sep 5, 2023·2 cites·1 claims
- 0661US2024120580A1Pouch-Type Battery and Sealing Device for Pouch-Type BatteryLG ENERGY SOLUTION LTD·Filed 2022·Application pending·0 cites
- 0758US11881268B2Semiconductor memory device and storage system including semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 0858US2025197573A1Encapsulant Film Composition and Encapsulant Film Including the SameLG CHEMICAL LTD·Filed 2023·Application pending·0 cites
- 0957USD846404SBox for food packagingCJ CHEILJEDANG CORP·Filed 2018·Granted Apr 23, 2019·7 cites·1 claims
- 1056US2022340698A1Composition for Encapsulant Film and Encapsulant Film Comprising the SameLG CHEMICAL LTD·Filed 2021·Application pending·0 cites
- 1155US10891073B2Storage apparatuses for virtualized system and methods for operating the sameRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2019·Granted Jan 12, 2021·0 cites·19 claims
- 1254USD846403SBox for food packagingCJ CHEILJEDANG CORP·Filed 2018·Granted Apr 23, 2019·6 cites·1 claims
- 1351USD1006635SBag for food packingCJ CHEILJEDANG CORP·Filed 2022·Granted Dec 5, 2023·1 cites·1 claims
- 1450US11233000B2Semiconductor package with inner lead pattern group and method for manufacturing the semiconductor packageMAGNACHIP SEMICONDUCTOR LTD·Filed 2019·Granted Jan 25, 2022·0 cites·12 claims
- 1550USD846405SBox for food packagingCJ CHEILJEDANG CORP·Filed 2018·Granted Apr 23, 2019·5 cites·1 claims
- 1649US10741521B2Semiconductor package and method of manufacturing semiconductor packageMAGNACHIP SEMICONDUCTOR LTD·Filed 2019·Granted Aug 11, 2020·0 cites·15 claims
- 1738US2022135928A1Device and method for determining operation condition of bioreactorCJ CHEILJEDANG CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →