Inventor · disambiguated record
Hyo-Jong Lee
Also filed as: LEE HYO · LEE HYO JONG
15 granted patents·14 pending applications·161 citations·filing 1997–2024
92Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9UNIV DONG A RES FOUND FOR IND ACAD COOP4UNIV INJE IND ACAD COOP FOUND3RN2 TECH CO LTD2SNU R&DB FOUNDATION2
Top patents by PatentIndex Score
29 records- 0189US9595638B2Light emitting diode package and method for manufacturing the samePUKYONG NAT UNIV INDUSTRY-UNIV COOP FOUND·Filed 2013·Granted Mar 14, 2017·32 cites·13 claims
- 0289US6787460B2Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formedSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 7, 2004·44 cites·24 claims
- 0374US7051934B2Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recessesSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 30, 2006·15 cites·28 claims
- 0471US5756412ADielectric ceramic compositionAMOTRON CO LTD·Filed 1997·Granted May 26, 1998·28 cites·11 claims
- 0570US6953745B2Void-free metal interconnection structure and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 11, 2005·17 cites·20 claims
- 0667US9138474B2Composition comprising expression or activity inhibitors of Ninjurin1 for the prevention and treatment of inflammatory diseaseSNU R&DB FOUNDATION·Filed 2013·Granted Sep 22, 2015·1 cites·3 claims
- 0767US7807337B2Inductor for a system-on-a-chip and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 5, 2010·4 cites·17 claims
- 0865US8618072B2Composition comprising expression or activity inhibitors of ninjurin1 for the prevention and treatment of inflammatory diseaseKIM KYU-WON·Filed 2011·Granted Dec 31, 2013·1 cites·3 claims
- 0964US2025129501A1Copper foil with high elongation rate and method of manufacturing sameUNIV DONG A RES FOUND FOR IND ACAD COOP·Filed 2024·Application pending·0 cites
- 1062US2024254650A1Electroplating apparatus for surface modification of pipesUNIV DONG A RES FOUND FOR IND ACAD COOP·Filed 2023·Application pending·0 cites
- 1161US2024093401A1Method of manufacturing multilayer metal plate by electroplating and multilayer metal plate manufactured therebyUNIV DONG A RES FOUND FOR IND ACAD COOP·Filed 2023·Application pending·0 cites
- 1256US2016120782A1Functional cosmetic composition characterized by containing growth factors and amino acidsHUMAN BIOTECH CO LTD·Filed 2014·Application pending·0 cites
- 1354US10537559B2Isonitramine compound and composition containing same for preventing or treating metabolic diseasesUNIV INJE IND ACAD COOP FOUND·Filed 2018·Granted Jan 21, 2020·0 cites·2 claims
- 1451US12351928B2Electrodeposition apparatus to prepare a multilayer copper foilUNIV DONG A RES FOUND FOR IND ACAD COOP·Filed 2022·Granted Jul 8, 2025·0 cites·4 claims
- 1550US2011123538A1Composition comprising expression or activity inhibitors of ninjurin 1 for the prevention and treatment of inflammatory diseaseSNU R&DB FOUNDATION·Filed 2008·Application pending·0 cites
- 1649US7048612B2Method of chemical mechanical polishingSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 23, 2006·3 cites·23 claims
- 1749US2018244624A1Novel isonitramine compound and composition containing same for preventing or treating metabolic diseasesUNIV INJE IND ACAD COOP FOUND·Filed 2016·Application pending·0 cites
- 1848US5985781ADielectric ceramic compositionsAMECS CO LTD·Filed 1998·Granted Nov 16, 1999·10 cites·5 claims
- 1948US2025194597A1Method for increasing flavonoid content in plant through treatment with low-molecular-weight sulfur compoundREPUBLIC OF KOREA RURAL DEV ADMINISTRATION·Filed 2022·Application pending·0 cites
- 2047US11766410B2Composition for preventing or treating dry eye syndrome containing α-humulene as active ingredientUNIV INJE IND ACAD COOP FOUND·Filed 2018·Granted Sep 26, 2023·0 cites·5 claims
- 2146US12451582B2Coupler having spiral coupling lineRN2 TECH CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·7 claims
- 2246US2006270228A1Method of forming metal pattern using selective electroplating processSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2345US2025385419A1Coupler and manufacturing method thereforRN2 TECH CO LTD·Filed 2024·Application pending·0 cites
- 2444US6476768B2Wireless transmitting and receiving antennaMRW TECHNOLOGIES LTD·Filed 2000·Granted Nov 5, 2002·6 cites·3 claims
- 2542US2006207875A1Electroplating apparatus and electroplating method using the sameLEE HYO-JONG·Filed 2006·Application pending·0 cites
- 2642US2006289999A1Selective copper alloy interconnections in semiconductor devices and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2741US2007059923A1Methods of fabricating damascene interconnection line in semiconductor devices and semiconductor devices fabricated using such methodsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2839US2005070090A1Method of forming metal pattern using selective electroplating processSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 2937US2005116317A1Inductor for a system-on-a-chip and method for manufacturing the sameFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →