Inventor · disambiguated record
Hyeok Lee
Also filed as: LEE HYEOK · LEE HYEOK-SOO
1 granted patent·2 pending applications·0 citations·filing 2003–2023
4Inventor score
Top patents by PatentIndex Score
3 records- 0155US2024157614A1Apparatus and method for expanded polypropylene moldingSEOYON E HWA CO LTD·Filed 2023·Application pending·0 cites
- 0238US10479017B2Sequential joint behavior sheet using photo deformation and method of controlling folding and unfolding thereofSEOUL NAT UNIV R&DB FOUNDATION·Filed 2015·Granted Nov 19, 2019·0 cites·8 claims
- 0315US2004195313A1Method for registering network information in mobile terminal using smart cardFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →