Inventor · disambiguated record
Hyeongju Lee
Also filed as: LEE HYEONGJU
11 granted patents·4 pending applications·24 citations·filing 2019–2024
86Inventor score
Top patents by PatentIndex Score
15 records- 0197US11277949B2Electronic device comprising interposer surrounding circuit elements disposed on printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 15, 2022·7 cites·27 claims
- 0292US11388277B2Electronic device including interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 12, 2022·6 cites·20 claims
- 0392US10709043B2Electronic device comprising interposer surrounding circuit elements disposed on printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 7, 2020·6 cites·20 claims
- 0491US11558496B2Electronic device including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 17, 2023·2 cites·30 claims
- 0589US11825639B2Electronic device comprising interposer surrounding circuit elements disposed on printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·1 cites·19 claims
- 0682US12274040B2Electronic device comprising interposer surrounding circuit elements disposed on printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·17 claims
- 0780US11330716B2Overlapping printed circuit boards and electronic device including sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·1 cites·20 claims
- 0873US11812555B2Overlapping printed circuit boards and electronic device including sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·14 claims
- 0968US11196847B2Electronic device including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 7, 2021·1 cites·13 claims
- 1061US2019373729A1Overlapping printed circuit boards and electronic device including sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1160US2024422954A1Electronic device including bridge printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1255US2024292571A1Electronic device comprising printed circuit board structure accommodating thermal interface materialSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1349US12022614B2Interposer and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·18 claims
- 1449US11180679B1Composition for semiconductor processing and method for polishing substrate using the sameSKC SOLMICS CO LTD·Filed 2020·Granted Nov 23, 2021·0 cites·13 claims
- 1540US2019319381A1Connector forming shielding space and electronic device having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →