Inventor · disambiguated record
Hyun-Bae Lee
Also filed as: LEE HYUN · LEE HYUN-BAE
39 granted patents·18 pending applications·106 citations·filing 2003–2024
96Inventor score
Files withSK HYNIX INC25SAMSUNG ELECTRONICS CO LTD20LEE JONG-MYEONG2CHOI KYUNG-IN1DONGBU ELECTRONICS CO LTD1
Top patents by PatentIndex Score
57 records- 0195US9667252B1Duty cycle correction circuit and duty cycle correction methodSK HYNIX INC·Filed 2016·Granted May 30, 2017·17 cites·24 claims
- 0292US12014988B2Semiconductor device having a graphene film and method for fabricating thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 18, 2024·2 cites·19 claims
- 0389US10418983B1Duty cycle correction circuitSK HYNIX INC·Filed 2018·Granted Sep 17, 2019·6 cites·20 claims
- 0487US9270256B2Duty cycle correction circuitSK HYNIX INC·Filed 2014·Granted Feb 23, 2016·8 cites·8 claims
- 0586US10790864B1Reception circuit, semiconductor apparatus and semiconductor system including the reception circuitSK HYNIX INC·Filed 2020·Granted Sep 29, 2020·2 cites·15 claims
- 0685US10419202B2Serializer, data transmitting circuit, semiconductor apparatus and system including the sameSK HYNIX INC·Filed 2018·Granted Sep 17, 2019·4 cites·17 claims
- 0783US7392012B2Apparatus and method for receiving signal in a multiple-input multiple-output communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 24, 2008·12 cites·9 claims
- 0880US8124524B2Methods of forming metal interconnection structuresCHOI KYUNG-IN·Filed 2010·Granted Feb 28, 2012·5 cites·9 claims
- 0980US7705690B2Serpentine guard trace for reducing crosstalk of micro-strip line on printed circuit boardPOSTECH FOUNDATION·Filed 2006·Granted Apr 27, 2010·8 cites·7 claims
- 1078US9474145B2Substrate and method for manufacturing semiconductor packageKIM JINGYU·Filed 2015·Granted Oct 18, 2016·5 cites·21 claims
- 1174US7816255B2Methods of forming a semiconductor device including a diffusion barrier filmSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 19, 2010·6 cites·7 claims
- 1273US10778163B2Amplification circuit, and receiving circuit, semiconductor apparatus and semiconductor system using the amplification circuitSK HYNIX INC·Filed 2018·Granted Sep 15, 2020·2 cites·24 claims
- 1372US10068878B2Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCBSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 4, 2018·2 cites·19 claims
- 1472US7724584B2Semiconductor memory device and method of compensating for signal interference thereofSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 25, 2010·8 cites·20 claims
- 1565US12506478B2Buffer circuit, semiconductor device, and signal processing system including semiconductor deviceSK HYNIX INC·Filed 2023·Granted Dec 23, 2025·0 cites·21 claims
- 1665US8374043B2Sense amplifier and semiconductor memory device using itSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Feb 12, 2013·5 cites·16 claims
- 1764US9867283B2Package board and prepregSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 9, 2018·1 cites·12 claims
- 1864US8932964B2Method of forming a dielectric layer having an ONO structure using an in-situ processLEE WOO-JIN·Filed 2012·Granted Jan 13, 2015·1 cites·16 claims
- 1963US7807571B2Semiconductor device and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 5, 2010·2 cites·31 claims
- 2062US9647664B2Output driver, semiconductor apparatus, system, and computing system using the sameSK HYNIX INC·Filed 2015·Granted May 9, 2017·1 cites·25 claims
- 2162US8211793B2Structures electrically connecting aluminum and copper interconnections and methods of forming the sameLEE JONG-MYEONG·Filed 2010·Granted Jul 3, 2012·2 cites·20 claims
- 2262US7759248B2Semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 20, 2010·1 cites·17 claims
- 2362US2025029640A1Memory device related to signal transmissionSK HYNIX INC·Filed 2024·Application pending·0 cites
- 2459US12046556B2Semiconductor devices having highly integrated active and power distribution regions thereinSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 23, 2024·0 cites·20 claims
- 2559US10727884B2Reception circuit, semiconductor apparatus and semiconductor system including the reception circuitSK HYNIX INC·Filed 2019·Granted Jul 28, 2020·0 cites·14 claims
- 2658US11550743B2Signal transmitting circuit, and semiconductor apparatus and semiconductor system using the sameSK HYNIX INC·Filed 2021·Granted Jan 10, 2023·0 cites·24 claims
- 2758US11502877B2Signal transmitting device, signal receiving device, transmitting and receiving system using the signal transmitting and receiving devices, and transmitting and receiving methodSK HYNIX INC·Filed 2021·Granted Nov 15, 2022·0 cites·21 claims
- 2856US2025150079A1Transmission and reception system and semiconductor apparatus using the transmission and reception systemSK HYNIX INC·Filed 2024·Application pending·0 cites
- 2955US11854979B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·17 claims
- 3055US6810334B2Method for inspecting wafer defects of a semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Oct 26, 2004·4 cites·6 claims
- 3153US10644685B1Signal receiving circuit, and semiconductor apparatus and semiconductor system using the signal receiving circuitSK HYNIX INC·Filed 2019·Granted May 5, 2020·0 cites·20 claims
- 3252US10523216B2Receiving circuit, semiconductor apparatus including the receiving circuit and semiconductor system using the receiving circuitSK HYNIX INC·Filed 2018·Granted Dec 31, 2019·0 cites·21 claims
- 3351US8027193B2Semiconductor memory device having bit line disturbance preventing unitSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 27, 2011·2 cites·20 claims
- 3451US2024203959A1Semiconductor memory module and computer system including the sameSK HYNIX INC·Filed 2023·Application pending·0 cites
- 3550US2008122076A1Conductive Wiring for Semiconductor DevicesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3649US2008012134A1Metal interconnection structures and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3747US10305483B1Receiving circuit and integrated circuit system using the receiving circuitSK HYNIX INC·Filed 2018·Granted May 28, 2019·0 cites·21 claims
- 3846US7574178B2Apparatus and method for cancelling interference in a mobile communication system using multiple antennasSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 11, 2009·0 cites·16 claims
- 3945US10284156B2Amplifier and semiconductor apparatus using the sameSK HYNIX INC·Filed 2017·Granted May 7, 2019·0 cites·16 claims
- 4045US2008174021A1Semiconductor devices having metal interconnections, semiconductor cluster tools used in fabrication thereof and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4145US2009166868A1Semiconductor devices including metal interconnections and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4245US2010317383A1Method of optimal data transmission for improving data transmission rate in multi-hop wireless networkLEE HYUN·Filed 2007·Application pending·0 cites
- 4344US2010237504A1Methods of Fabricating Semiconductor Devices Having Conductive Wirings and Related Flash Memory DevicesHONG JONG-WON·Filed 2010·Application pending·0 cites
- 4443US2008042290A1Structures Electrically Connecting Aluminum and Copper Interconnections and Methods of Forming the SameLEE JONG-MYEONG·Filed 2007·Application pending·0 cites
- 4543US2005135289A1Apparatus and method for data rate transmission of user equipment in mobile communication systemFiled 2004·Application pending·0 cites
- 4642US9666236B2Multi-chip packageSK HYNIX INC·Filed 2016·Granted May 30, 2017·0 cites·15 claims
- 4742US2007188382A1Base station and mobile terminal for location detection, and location detecting methodSHIN CHANG-SUB·Filed 2007·Application pending·0 cites
- 4841US2005191965A1Method and apparatus for controlling transmission of channel quality information according to characteristics of a time-varying channel in a mobile communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4940US9953921B2Semiconductor device and semiconductor packageSK HYNIX INC·Filed 2016·Granted Apr 24, 2018·0 cites·16 claims
- 5039US9390775B2Reference voltage setting circuit and method for data channel in memory systemSK HYNIX INC·Filed 2013·Granted Jul 12, 2016·0 cites·17 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →