Inventor · disambiguated record
Hyoung Soon Lee
Also filed as: LEE HYOUNG SOON
1 granted patent·7 pending applications·2 citations·filing 2022–2024
20Inventor score
Files withHYUNDAI MOTOR CO LTD3REPUBLIC OF KOREA DEFENSE ACQUISITION PROGRAM ADMINISTRATION2UNIV CHUNG ANG IND ACAD COOP FOUND2CHUNG ANG UNIV INDUSTRY ACADEMIC COOPERAITON FOUNDATION1
Top patents by PatentIndex Score
8 records- 0188US12150273B2Cooling apparatus for power moduleHYUNDAI MOTOR CO LTD·Filed 2022·Granted Nov 19, 2024·2 cites·13 claims
- 0276US2025048589A1Cooling apparatus for power moduleHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0373US2025038069A1Packaging unit for direct cooling of semiconductor device and manufacturing method thereofUNIV CHUNG ANG IND ACAD COOP FOUND·Filed 2024·Application pending·0 cites
- 0462US2023361000A1Packaging unit for direct cooling of semiconductor device and manufacturing method thereofCHUNG ANG UNIV INDUSTRY ACADEMIC COOPERAITON FOUNDATION·Filed 2022·Application pending·0 cites
- 0559US2025309716A1Stator having a cooling structure and a motor including the statorHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0650US2024266253A1Direct cooling device for integrated circuit and manufacturing method thereofREPUBLIC OF KOREA DEFENSE ACQUISITION PROGRAM ADMINISTRATION·Filed 2024·Application pending·0 cites
- 0750US2024266251A1Direct cooling type semiconductor package unit and manufacturing method thereofREPUBLIC OF KOREA DEFENSE ACQUISITION PROGRAM ADMINISTRATION·Filed 2024·Application pending·0 cites
- 0840US2024355699A1Semiconductor device thermal management module and manufacturing method thereofUNIV CHUNG ANG IND ACAD COOP FOUND·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →