Inventor · disambiguated record
Hyunjin Lee
Also filed as: LEE HYUNJIN · LEE HYUNJIN ABRAHAM
11 granted patents·35 pending applications·54 citations·filing 2005–2025
86Inventor score
Files withSAMSUNG ELECTRONICS CO LTD24SAMSUNG SDI CO LTD10KOREA ADVANCED INST SCI & TECH3ORACLE INT CORP3HYUNDAI MOTOR CO LTD2
Top patents by PatentIndex Score
46 records- 0192US7402862B2Multi-bit non-volatile memory device having a dual-gate and method of manufacturing the same, and method of multi-bit cell operationKOREA ADVANCED INST SCI & TECH·Filed 2006·Granted Jul 22, 2008·29 cites·10 claims
- 0290US11369894B1Online fuel cutpoint control application using color spectrumPHILLIPS 66 CO·Filed 2021·Granted Jun 28, 2022·3 cites·6 claims
- 0389US11459512B1Online fuel cutpoint control application using color spectrumPHILLIPS 66 CO·Filed 2021·Granted Oct 4, 2022·3 cites·17 claims
- 0486US11126555B2Multi-line data prefetching using dynamic prefetch depthORACLE INT CORP·Filed 2020·Granted Sep 21, 2021·2 cites·20 claims
- 0586US7419857B2Method for manufacturing field effect transistor having channel consisting of silicon fins and silicon body and transistor structure manufactured therebyKOREA ADVANCED INST SCI & TECH·Filed 2005·Granted Sep 2, 2008·14 cites·5 claims
- 0678US10579531B2Multi-line data prefetching using dynamic prefetch depthORACLE INT CORP·Filed 2017·Granted Mar 3, 2020·2 cites·20 claims
- 0775US2025329705A1Apparatus and method for manufacturing secondary battery electrode plate with multistage coated portionsSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0875US2025316678A1Apparatus and method for manufacturing secondary battery for improvement of brittleness of electrode plateSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0974US2025246598A1Electrode for rechargeable batterySAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1074US2025296061A1Apparatus for mixing and agitating secondary battery electrode materials and control method thereofSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1174US2025316674A1Multilayer electrode manufacturing apparatus and multilayer electrode manufacturing method using the sameSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1273US2025316680A1Secondary battery manufacturing apparatus and method for preventing wrinkle of uncoated portionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1372US2025062311A1Manufacturing method of electrode for rechargeable batterySAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1471US2024367376A13d printing apparatus and 3d printing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1570US10474578B2Utilization-based throttling of hardware prefetchersORACLE INT CORP·Filed 2017·Granted Nov 12, 2019·1 cites·20 claims
- 1667US2025273649A1Apparatus and method for manufacturing electrode substrate of secondary battery and electrode substrate manufactured by the methodSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1765US12070903B23D printing apparatus and 3D printing methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·19 claims
- 1864US2025374528A1Integrated circuit devices having enhanced back-gate separation patterns therein and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1964US2025296054A1Slurry mixing apparatusSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 2063US2025220890A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2163US2025254861A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2263US2025234506A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2362US2025254857A1Semiconductor device including supporter patternSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2462US2025288968A1Apparatus for mixing and agitating electrode materials for secondary batterySAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 2560US2024431097A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2659US2025016994A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2758US2025176166A1Semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2857US2024341089A1Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2957US2025365933A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3056US2025140588A1Die bonding apparatus and die bonding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3156US2024284662A1Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3256US2025201602A1Hybrid bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3356US2025180994A1Selective photoresist application method and semiconductor package manufacturing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3456US2024290626A1Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3556US2025071969A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3655US2025393201A1Semiconductor device including active patternSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3754US2025267838A1Method of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3853US2024282604A1Semiconductor processing apparatus and method of manufacturing semiconductor device using semiconductor processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3953US2025220894A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4048US2023401664A1Mobility service platform and movility service method providing transfer serviceHYUNDAI MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 4147US11581202B2Substrate debonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 4247US2025377639A1Control method for semiconductor equipment and control system thereforSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4346US2023274300A1Mobility service apparatus and method using flexible rateHYUNDAI MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 4445US2025076845A1Server, method, program and computer-readable recording medium for operating 3-dimensional dental laminate modification for attaching ornamentsE32 TECH INC·Filed 2023·Application pending·0 cites
- 4542US9931838B2Method of controlling film thickness distribution and method of manufacturing display apparatus using the methodSAMSUNG DISPLAY CO LTD·Filed 2016·Granted Apr 3, 2018·0 cites·19 claims
- 4642US7491597B2Flash memory device capable of erasing flash blocks in SOI substrate based on back-bias, method for manufacturing the same, and flash block erasion method and structure thereofKOREA ADVANCED INST SCI & TECH·Filed 2006·Granted Feb 17, 2009·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →