Inventor · disambiguated record
Hyeonseok Lee
Also filed as: LEE HYEONSEOK
6 granted patents·13 pending applications·5 citations·filing 2018–2025
73Inventor score
Top patents by PatentIndex Score
19 records- 0193US12057435B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 6, 2024·2 cites·20 claims
- 0285US2025364489A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0384US11948872B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·1 cites·20 claims
- 0482US12394753B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 0579US12230556B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 18, 2025·0 cites·16 claims
- 0677US10715054B2Power conversion device and photovoltaic module including the sameLG ELECTRONICS INC·Filed 2019·Granted Jul 14, 2020·1 cites·20 claims
- 0769US2025149418A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0863US10361641B2Power conversion device and photovoltaic module including the sameLG ELECTRONICS INC·Filed 2018·Granted Jul 23, 2019·1 cites·20 claims
- 0963US2024270612A1Selective precipitation of solutes from aqueous solutions and related systemsBATTELLE ENERGY ALLIANCE LLC·Filed 2022·Application pending·0 cites
- 1061US2024346312A1Electronic device and controlling method of electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1159US2025281872A1Carbon dioxide selective membranes, gas separation systems including the carbon dioxide selective membranes, and related methodsBATTELLE ENERGY ALLIANCE LLC·Filed 2023·Application pending·0 cites
- 1257US2025233094A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1355US2024128145A1Semiconductor packages and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1455US2024120286A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1553US2024071894A1Packaged integrated circuit having enhanced electrical interconnects thereinSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1653US2024038642A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1752US2024065003A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1849US2023361017A1Package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1942US2021285909A1Method for measuring concentration of biometric measurement object by using artificial intelligence deep learningI SENS INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →