Inventor · disambiguated record
Hyeonchul Lee
Also filed as: LEE HYEONCHUL
2 granted patents·5 pending applications·0 citations·filing 2021–2025
23Inventor score
Top patents by PatentIndex Score
7 records- 0157US2025038059A1Modular interconnection unit, semiconductor package and method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0256US2024347509A1Semiconductor package strip and method for forming a semiconductor deviceJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0353US2025201733A1Semiconductor Device and Method of Forming Protective Layer on Substrate to Avoid Damage During EncapsulationJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 0452US11594438B2Semiconductor manufacturing device to securely hold semiconductor panels for transport and manufacturing processesSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 28, 2023·0 cites·21 claims
- 0550US2025309136A1Shielded conductive device, a method for forming the same and an electronic package assemblyJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0649US2023395449A1Method and apparatus for forming semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0747US11935777B2Semiconductor manufacturing equipment and method of providing support base with filling material disposed into openings in semiconductor wafer for supportSTATS CHIPPAC PTE LTD·Filed 2021·Granted Mar 19, 2024·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →