Inventor · disambiguated record
Hyuekjae Lee
Also filed as: LEE HYUEKJAE
25 granted patents·17 pending applications·56 citations·filing 2010–2025
94Inventor score
Top patents by PatentIndex Score
42 records- 0196US11404395B2Semiconductor package including underfill material layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·8 cites·18 claims
- 0295US11289438B2Die-to-wafer bonding structure and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 29, 2022·5 cites·20 claims
- 0395US11244927B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 8, 2022·4 cites·20 claims
- 0494US11721673B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 8, 2023·3 cites·20 claims
- 0594US11658141B2Die-to-wafer bonding structure and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·3 cites·20 claims
- 0691US11984421B2Integrated circuit chip having BS-PDN structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 14, 2024·3 cites·20 claims
- 0791US11694996B2Semiconductor package including a pad contacting a viaSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 4, 2023·2 cites·17 claims
- 0888US11158594B2Semiconductor packages having improved reliability in bonds between connection conductors and padsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 26, 2021·2 cites·20 claims
- 0988US8399987B2Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layersKWON WOONSEONG·Filed 2010·Granted Mar 19, 2013·19 cites·41 claims
- 1083US11552033B2Packaged multi-chip semiconductor devices and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·1 cites·18 claims
- 1180US12261164B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 1280US12237308B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1379US11658148B2Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 23, 2023·1 cites·20 claims
- 1479US2025015026A1Packaged multi-chip semiconductor devices and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1577US2024332255A1Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1676US12132019B2Packaged multi-chip semiconductor devices and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1776US12040313B2Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 1873US2025364491A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1972US8558371B2Method for wafer level package and semiconductor device fabricated using the sameHONG JISUN·Filed 2011·Granted Oct 15, 2013·5 cites·16 claims
- 2071US11798929B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 2169US11955449B2Stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 2269US11901336B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 2369US11764192B2Semiconductor package including underfill material layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 2466US2025259914A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2565US12438064B2Semiconductor package with bonding interfaceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 2663US11676925B2Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 2763US11508685B2Stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 2863US2025183194A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2960US2025157908A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3059US2024258278A1Semiconductor package including stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3158US12512428B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 3258US2024234349A9Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3357US2024096831A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3456US2024055372A1Highly integrated semiconductor device containing multiple bonded diesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3556US2024030074A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3656US2024404970A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3756US2024072003A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3856US2022208649A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 3954US2023378110A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4052US2024071995A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4151US11527509B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 4235US2016314996A1Substrate treating apparatus and a method for treating a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →