Inventor · disambiguated record
Hyunglak Ma
Also filed as: MA HYUNGLAK
1 granted patent·2 pending applications·0 citations·filing 2020–2024
3Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0156US2024429110A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0248US2023110126A1Semiconductor packages having a package substrate and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0345US11367714B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →