Inventor · disambiguated record
Hyoungill Min
Also filed as: MIN HYOUNGILL
0 granted patents·2 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0152US2024363515A1Semiconductor package structure and forming method thereofSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2024·Application pending·0 cites
- 0252US2024379701A1Sensor package structure and packaging methodSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →