Inventor · disambiguated record
Hyoung-Yol Mun
Also filed as: MUN HYOUNG YOL
5 granted patents·33 citations·filing 2014–2022
75Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0189US9070729B2Wafer processing method and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 30, 2015·21 cites·20 claims
- 0281US9293415B2Semiconductor devices including protection patterns and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 22, 2016·4 cites·20 claims
- 0377US9087885B2Method of fabricating semiconductor devices having through-silicon via (TSV) structuresSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 21, 2015·6 cites·16 claims
- 0456US9437554B2Semiconductor package having magnetic substance and related equipmentJI SANG-WOOK·Filed 2014·Granted Sep 6, 2016·2 cites·14 claims
- 0553US11887840B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →