Inventor · disambiguated record
Hyunggyun Noh
Also filed as: NOH HYUNGGYUN
2 granted patents·5 pending applications·1 citations·filing 2021–2025
31Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0174US11961824B2Semiconductor package including stacked chip structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 16, 2024·1 cites·20 claims
- 0247US11735491B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 0345US2024194642A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0445US2025309197A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0544US2024429111A1Semiconductor memory module including fixing structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0644US2024258203A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0743US2024194563A1Semiconductor package and method for fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →