Inventor · disambiguated record
Hyuk Park
Also filed as: PARK HYUK · PARK HYUK JAE
9 granted patents·9 pending applications·47 citations·filing 2003–2024
83Inventor score
Top patents by PatentIndex Score
18 records- 0187US7556998B2Method of manufacturing semiconductor devicesDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Jul 7, 2009·30 cites·4 claims
- 0278US8030779B2Multi-layered metal interconnectionDONGBU HITEK CO LTD·Filed 2009·Granted Oct 4, 2011·8 cites·7 claims
- 0373US7507611B2Thin film transistor and method for manufacturing the sameDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Mar 24, 2009·5 cites·15 claims
- 0460US2025194017A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0558US7678686B2Semiconductor device having copper metal line and method of forming the sameDONGBU HITEK CO LTD·Filed 2007·Granted Mar 16, 2010·2 cites·4 claims
- 0650US7732871B2MOS transistor and manufacturing method thereofDONGBU ELECTRONICS CO LTD·Filed 2009·Granted Jun 8, 2010·0 cites·11 claims
- 0747US7553759B2Semiconductor device and method of manufacturing a semiconductor deviceDONGBU HITEK CO LTD·Filed 2006·Granted Jun 30, 2009·0 cites·10 claims
- 0845US7556954B2MOS transistor and manufacturing method thereofDONGBU ELECTRONICS CO LTD·Filed 2006·Granted Jul 7, 2009·0 cites·20 claims
- 0945US2015183678A1Method of cutting a non-metallic material along a curved lineRORZE SYSTEMS CORP·Filed 2013·Application pending·0 cites
- 1044US2008258145A1Semiconductor Devices Including an Amorphous Region in an Interface Between a Device Isolation Layer and a Source/Drain Diffusion LayerPARK HYUK·Filed 2008·Application pending·0 cites
- 1143US2008157233A1Method for fabricating a semiconductor deviceDONGBU HITEK CO LTD·Filed 2007·Application pending·0 cites
- 1242US7105887B2Memory cell structures including a gap filling layer and methods of fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Sep 12, 2006·2 cites·8 claims
- 1342US2022128386A1Three-ply drum shell with aerated corePARK HYUK JAE·Filed 2020·Application pending·0 cites
- 1440US2019217573A1Flexible substrate, manufacturing method thereof, and flexible electronic device including the samePOSTECH ACAD IND FOUND·Filed 2019·Application pending·0 cites
- 1539US2007161207A1Method for Manufacturing Semiconductor DevicePARK HYUK·Filed 2006·Application pending·0 cites
- 1639US2014284366A1Method of cutting a tempered glass substrateRORZE SYSTEMS CORP·Filed 2012·Application pending·0 cites
- 1738US2022172697A1Tone-enhancing drum shell and methods of making and using samePARK HYUK JAE·Filed 2019·Application pending·0 cites
- 1837US7399669B2Semiconductor devices and methods for fabricating the same including forming an amorphous region in an interface between a device isolation layer and a source/drain diffusion layerDONGBU ELECTRONICS CO LTD·Filed 2004·Granted Jul 15, 2008·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →