Inventor · disambiguated record
Hyungsang Park
Also filed as: PARK HYUNGSANG
12 granted patents·2 pending applications·87 citations·filing 2007–2019
89Inventor score
Top patents by PatentIndex Score
14 records- 0197US9837484B2Semiconductor device and method of forming substrate including embedded component with symmetrical structureSTATS CHIPPAC LTD·Filed 2015·Granted Dec 5, 2017·31 cites·24 claims
- 0290US7607727B2Armrest locking deviceHYUNDAI MOBIS CO LTD·Filed 2007·Granted Oct 27, 2009·26 cites·7 claims
- 0381US10236337B2Semiconductor device and method of forming substrate including embedded component with symmetrical structureSTATS CHIPPAC PTE LTD·Filed 2017·Granted Mar 19, 2019·2 cites·25 claims
- 0481US8569869B2Integrated circuit packaging system with encapsulation and method of manufacture thereofPARK HYUNGSANG·Filed 2010·Granted Oct 29, 2013·7 cites·20 claims
- 0579US8314486B2Integrated circuit packaging system with shield and method of manufacture thereofCHI HEEJO·Filed 2010·Granted Nov 20, 2012·5 cites·20 claims
- 0676US7859099B2Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Dec 28, 2010·6 cites·20 claims
- 0775US9324659B2Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower dieCHO SUNGWON·Filed 2011·Granted Apr 26, 2016·4 cites·23 claims
- 0869US9210816B1Method of manufacture of support system with fine pitchROH YOUNGDAL·Filed 2013·Granted Dec 8, 2015·2 cites·20 claims
- 0965US8102666B2Integrated circuit package systemPARK HYUNGSANG·Filed 2008·Granted Jan 24, 2012·3 cites·10 claims
- 1064US10665662B2Semiconductor device and method of forming substrate including embedded component with symmetrical structureSTATS CHIPPAC PTE LTD·Filed 2019·Granted May 26, 2020·0 cites·21 claims
- 1157US8592973B2Integrated circuit packaging system with package-on-package stacking and method of manufacture thereofPARK HYUNGSANG·Filed 2009·Granted Nov 26, 2013·1 cites·20 claims
- 1247US8093100B2Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereofCHOI A LEAM·Filed 2010·Granted Jan 10, 2012·0 cites·20 claims
- 1337US2012119345A1Integrated circuit packaging system with device mount and method of manufacture thereofCHO SUNGWON·Filed 2010·Application pending·0 cites
- 1429US2017069565A1Integrated circuit packaging system with single-layer support structureSTATS CHIPPAC PTE LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →