Inventor · disambiguated record
Hyo-Chang Ryu
Also filed as: RYU HYO-CHANG
9 granted patents·1 pending application·31 citations·filing 2010–2023
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0194US8829686B2Package-on-package assembly including adhesive containment elementSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Sep 9, 2014·24 cites·19 claims
- 0287US11145637B2Semiconductor package including a substrate having two silicon layers formed on each otherSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 12, 2021·4 cites·19 claims
- 0385US11721679B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 8, 2023·1 cites·19 claims
- 0478US12278222B2Method of fabricating semiconductor package including sub-interposer substratesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 0565US9899294B2Thermal interface material layer and package-on-package device including the sameNA MIN OK·Filed 2013·Granted Feb 20, 2018·2 cites·18 claims
- 0659US10950521B2Thermal interface material layer and package-on-package device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 0755US11670565B2Semiconductor package with heat dissipation memberSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 0855US10431522B2Thermal interface material layer and package-on-package device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·20 claims
- 0949US11217503B2Semiconductor package having logic semiconductor chip and memory packages on interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·19 claims
- 1036US2011109000A1Semiconductor package and method of forming the sameKIM SANG-UK·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →