Inventor · disambiguated record
Hyunsu Sim
Also filed as: SIM HYUNSU
4 granted patents·4 pending applications·2 citations·filing 2020–2025
59Inventor score
Top patents by PatentIndex Score
8 records- 0190US11676914B2Semiconductor substrate and method of sawing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0268US12062626B2Semiconductor substrate and method of sawing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·19 claims
- 0365US11854892B2Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by themSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·17 claims
- 0460US11322405B2Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by themSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 0560US2025291390A1Display moduleSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 0658US2025344328A1Foldable display device and electronic device including the sameSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 0749US2023082384A1Substrate processing apparatus and method of manufacturing semiconductor chip using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0847US2022392851A1Semiconductor chip and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →