Inventor · disambiguated record
Hyeonjun Song
Also filed as: SONG HYEONJUN
4 granted patents·3 pending applications·2 citations·filing 2020–2025
59Inventor score
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0186US11257794B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 22, 2022·2 cites·20 claims
- 0273US2025379192A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0373US2025379176A1Semiconductor package including a plurality of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0465US11658160B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·0 cites·20 claims
- 0561US12424582B2Semiconductor package including a plurality of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 0660US2023029098A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0749US11469099B2Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →