Inventor · disambiguated record
Hyunsu Tak
Also filed as: TAK HYUNSU
1 granted patent·2 pending applications·0 citations·filing 2021–2024
10Inventor score
Top patents by PatentIndex Score
3 records- 0154US2024421015A1Semiconductor package and method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0247US11935777B2Semiconductor manufacturing equipment and method of providing support base with filling material disposed into openings in semiconductor wafer for supportSTATS CHIPPAC PTE LTD·Filed 2021·Granted Mar 19, 2024·0 cites·25 claims
- 0347US2024105538A1Method for making an electronic packageJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hyunsu Tak files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →