Inventor · disambiguated record
Hyun Jung Woo
Also filed as: WOO HYUN-JUNG
8 granted patents·1 pending application·258 citations·filing 1995–2007
89Inventor score
Top patents by PatentIndex Score
9 records- 0189US6054331AApparatus and methods of depositing a platinum film with anti-oxidizing function over a substrateTONG YANG CEMENT CORP·Filed 1998·Granted Apr 25, 2000·97 cites·28 claims
- 0273US6025205AApparatus and methods of forming preferred orientation-controlled platinum films using nitrogenTONG YANG CEMENT CORP·Filed 1998·Granted Feb 15, 2000·45 cites·21 claims
- 0370US6498097B1Apparatus and method of forming preferred orientation-controlled platinum film using oxygenTONG YANG CEMENT CORP·Filed 1998·Granted Dec 24, 2002·41 cites·45 claims
- 0470US5736422AMethod for depositing a platinum layer on a silicon waferDONG YANG CEMENT CORP·Filed 1995·Granted Apr 7, 1998·40 cites·13 claims
- 0565US6993828B2Method for manufacturing metal thin film resistorINOSTEK INC·Filed 2002·Granted Feb 7, 2006·7 cites·6 claims
- 0661US6723186B2Method of manufacturing metallic film consisting of giant single crystal grainsINOSTEK INC·Filed 2001·Granted Apr 20, 2004·10 cites·6 claims
- 0745US6312567B1Method of forming a (200)-oriented platinum layerTONG YANG CEMENT CORP·Filed 1999·Granted Nov 6, 2001·13 cites·26 claims
- 0844US2008191319A1Semiconductor chip suppressing a void during a die attaching process and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0936US5981390AMethod for depositing a platinum layer on a silicon waferTONG YANG CEMENT CORP·Filed 1997·Granted Nov 9, 1999·5 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →