Inventor · disambiguated record
Hyun-Kwan Yu
Also filed as: YU HYUN-KWAN
23 granted patents·13 pending applications·44 citations·filing 2011–2024
93Inventor score
Top patents by PatentIndex Score
36 records- 0194US10243045B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 26, 2019·14 cites·16 claims
- 0293US11569350B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·3 cites·18 claims
- 0390US10121791B2Multi-gate transistorSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 6, 2018·7 cites·20 claims
- 0488US11935943B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 19, 2024·1 cites·20 claims
- 0588US10896964B2Semiconductor devices having variously-shaped source/drain patternsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 19, 2021·4 cites·20 claims
- 0684US11784255B2Semiconductor devices with bent portionsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 10, 2023·1 cites·20 claims
- 0781US2024204070A1Semiconductor devices having variously-shaped source/drain patternsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0880US11942528B2Semiconductor devices having variously-shaped source/drain patternsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 26, 2024·0 cites·20 claims
- 0978US11069776B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 20, 2021·1 cites·20 claims
- 1078US8623729B2Methods of fabricating semiconductor devices with silicon-germanium channels including hydrogenJEONG YONGKUK·Filed 2012·Granted Jan 7, 2014·5 cites·16 claims
- 1177US10505010B2Semiconductor device blocking leakage current and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 10, 2019·3 cites·17 claims
- 1270US11688781B2Semiconductor devices having variously-shaped source/drain patternsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·19 claims
- 1365US8691643B2Methods of forming semiconductor devicesKIM KIEUN·Filed 2011·Granted Apr 8, 2014·3 cites·20 claims
- 1463US9812557B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·1 cites·19 claims
- 1563US2025241043A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1662US12471323B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·13 claims
- 1761US11239344B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 1, 2022·0 cites·20 claims
- 1861US9865698B2Semiconductor device blocking leakage current and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 9, 2018·1 cites·16 claims
- 1961US2025142931A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2060US2025081559A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2159US10505009B2Semiconductor device with fin-type patternsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 10, 2019·0 cites·20 claims
- 2259US2024194786A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2358US2024234543A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2458US2025056861A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2556US10243056B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 26, 2019·0 cites·9 claims
- 2654US2024055428A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2754US2019081168A1Semiconductor devices with bent portionsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 2854US2023253449A1Semiconductor device and method for fabricating thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2951US2014084379A1Semiconductor devices with silicon-germanium channels including hydrogenSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 3041US11010532B2Simulation method and systemSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 18, 2021·0 cites·19 claims
- 3141US10790133B2Precleaning apparatus and substrate processing systemSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 29, 2020·0 cites·13 claims
- 3239US9812332B2Etching methods and methods of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 7, 2017·0 cites·20 claims
- 3336US8772173B2Method of manufacturing semiconductor deviceYU HYUN-KWAN·Filed 2012·Granted Jul 8, 2014·0 cites·18 claims
- 3434US2011306198A1Method of fabricating semiconductor integrated circuit deviceJEONG YONG-KUK·Filed 2011·Application pending·0 cites
- 3533US10615162B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 7, 2020·0 cites·13 claims
- 3632US2011309452A1Methods of manufacturing semiconductor devicesJEONG YONGKUK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →