Inventor · disambiguated record
Hyung Sun Yun
Also filed as: YUN HYUNG S · YUN HYUNG SUN
3 granted patents·8 pending applications·4 citations·filing 2005–2025
58Inventor score
Top patents by PatentIndex Score
11 records- 0166US2025366281A1Mled device having a nano sponge electrode pad for high-precision bonding and manufacturing method of the sameWAVELORD CO LTD·Filed 2025·Application pending·0 cites
- 0260US7745299B2Semiconductor device and fabrication method thereofDONGBU ELECTRONICS CO LTD·Filed 2008·Granted Jun 29, 2010·2 cites·19 claims
- 0355US7598550B2MOS transistor and manufacturing method thereofDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Oct 6, 2009·2 cites·9 claims
- 0454US2025324644A1High-quality gan hemt power semiconductor epitaxy wafer with 3d nitride structure and manufacturing method of the sameWAVELORD CO LTD·Filed 2025·Application pending·0 cites
- 0554US2025324643A1Gan hemt epitaxial wafer based on aln thick film and manufacturing method of the sameWAVELORD CO LTD·Filed 2025·Application pending·0 cites
- 0654US2025324631A1Method for manufacturing gan hemt power semiconductor epitaxial wafers with high-quality gan channel region through growth temperature modulationWAVELORD CO LTD·Filed 2025·Application pending·0 cites
- 0745US7465979B2Semiconductor device and fabrication method thereofDONGBU ELECTRONICS CO LTD·Filed 2006·Granted Dec 16, 2008·0 cites·12 claims
- 0835US2007166952A1Dual isolation structure of semiconductor device and method of forming the sameDONGBU ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0934US2007120200A1MOS transistor having double gate and manufacturing method thereofDONGBUANAM SEMICONDUCTOR INC·Filed 2005·Application pending·0 cites
- 1032US2009072318A1Semiconductor Device and Method of Fabricating the SameYUN HYUNG SUN·Filed 2008·Application pending·0 cites
- 1132US2007166953A1Semiconductor device and method of fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →