Inventor · disambiguated record
Hyeonjun Yun
Also filed as: YUN HYEONJUN
1 granted patent·2 pending applications·1 citations·filing 2020–2024
14Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0167US11443965B2Wafer to wafer bonding apparatusesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 13, 2022·1 cites·20 claims
- 0255US2025218826A1Electronic device and method of operation thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0355US2025279267A1Semiconductor processing systemSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →