Inventor · disambiguated record
I-Feng Chang
Also filed as: CHANG I-FENG
3 granted patents·52 citations·filing 2002–2003
72Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0177US6707164B2Package of semiconductor chip with array-type bonding padsACER LABS INC·Filed 2002·Granted Mar 16, 2004·29 cites·18 claims
- 0272US6762507B2Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the sameALI CORP·Filed 2003·Granted Jul 13, 2004·19 cites·6 claims
- 0348US6759329B2Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the sameALI CORP·Filed 2003·Granted Jul 6, 2004·4 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →