Inventor · disambiguated record
I-I Cheng
Also filed as: CHENG I-I
10 granted patents·19 citations·filing 2012–2020
85Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6TAIWAN SEMICONDUCTOR MFG2HUNG CHIA-YANG1TAIWAN SEMICONDUCTOR MANFACTURING COMPANY LTD1
Top patents by PatentIndex Score
10 records- 0184US9640456B2Support structure for integrated circuitryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 2, 2017·5 cites·20 claims
- 0283US10056426B2Apparatus and method for fabricating a light guiding gridTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 21, 2018·5 cites·20 claims
- 0379US10340301B2Support structure for integrated circuitryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 2, 2019·2 cites·20 claims
- 0473US9142588B2Backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 22, 2015·2 cites·20 claims
- 0571US8884390B2Backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MANFACTURING COMPANY LTD·Filed 2013·Granted Nov 11, 2014·2 cites·20 claims
- 0670US11177306B2Support structure for integrated circuitryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 16, 2021·0 cites·19 claims
- 0764US8872301B2Dual profile shallow trench isolation apparatus and systemHUNG CHIA-YANG·Filed 2012·Granted Oct 28, 2014·3 cites·20 claims
- 0862US10535694B2Support structure for integrated circuitryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 14, 2020·0 cites·20 claims
- 0953US9450014B2Backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 20, 2016·0 cites·20 claims
- 1046US9217917B2Three-direction alignment markTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 22, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →