Inventor · disambiguated record
I-Tseng Lee
Also filed as: LEE I-TSENG
7 granted patents·6 pending applications·49 citations·filing 2001–2020
81Inventor score
Files withVIA TECH INC4ADVANCED MICRO DEVICES SHANGHAI CO LTD2ADVANCED MICRO DEVICE SHANGHAI CO LTD1ADVANCED MICRO DEVICES CO LTD SHANGHAI1ADVANCED MICRO DEVICES INC1
Top patents by PatentIndex Score
13 records- 0180US6946601B1Electronic package with passive componentsVIA TECH INC·Filed 2004·Granted Sep 20, 2005·34 cites·25 claims
- 0277US9214438B2Die-die stacking structure and method for making the sameADVANCED MICRO DEVICES SHANGHAI CO LTD·Filed 2015·Granted Dec 15, 2015·3 cites·13 claims
- 0360US7143509B2Circuit board and processing method thereofVIA TECH INC·Filed 2005·Granted Dec 5, 2006·2 cites·20 claims
- 0455US8994191B2Die-die stacking structure and method for making the sameADVANCED MICRO DEVICES CO LTD SHANGHAI·Filed 2014·Granted Mar 31, 2015·1 cites·39 claims
- 0551US9870969B2SubstrateADVANCED MICRO DEVICES (SHANGHAI) CO LTD·Filed 2014·Granted Jan 16, 2018·0 cites·4 claims
- 0650US6919628B2Stack chip package structureVIA TECH INC·Filed 2003·Granted Jul 19, 2005·6 cites·15 claims
- 0747US7248477B2Fan-shaped heat-dissipating deviceVIA TECH INC·Filed 2004·Granted Jul 24, 2007·3 cites·12 claims
- 0846US2018102296A1SubstrateADVANCED MICRO DEVICE SHANGHAI CO LTD·Filed 2017·Application pending·0 cites
- 0946US2022208559A1Method and apparatus for chip manufacturingADVANCED MICRO DEVICES INC·Filed 2020·Application pending·0 cites
- 1037US2011278054A1Circuit board with notched conductor padsLEE I-TSENG·Filed 2010·Application pending·0 cites
- 1137US2012326299A1Semiconductor chip with dual polymer film interconnect structuresTOPACIO RODEN R·Filed 2011·Application pending·0 cites
- 1233US2002180057A1Chip stack-type semiconductor packageFiled 2001·Application pending·0 cites
- 1330US2011299259A1Circuit board with conductor post structureHSIEH YU-LING·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →