Inventor · disambiguated record
I-Ting Lin
Also filed as: LIN I-TING
6 granted patents·3 pending applications·12 citations·filing 2017–2025
74Inventor score
Top patents by PatentIndex Score
9 records- 0187US11018120B2Semiconductor device package with stress buffering layer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 25, 2021·4 cites·17 claims
- 0287US10050051B1Memory device and method for fabricating the sameMACRONIX INT CO LTD·Filed 2017·Granted Aug 14, 2018·8 cites·15 claims
- 0382US2025273638A1Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0480US12300677B2Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted May 13, 2025·0 cites·13 claims
- 0571US11721678B2Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 8, 2023·0 cites·17 claims
- 0662US12513815B2Electronic device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 0758US2025343213A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0855US2025038106A1Bond structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 0937US10424593B2Three-dimensional non-volatile memory and manufacturing method thereofMACRONIX INT CO LTD·Filed 2018·Granted Sep 24, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →