Inventor · disambiguated record
I-Shi Wang
Also filed as: WANG I-SHI
31 granted patents·2 pending applications·22 citations·filing 2011–2025
94Inventor score
Top patents by PatentIndex Score
33 records- 0192US11174156B2Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 16, 2021·2 cites·20 claims
- 0288US12258265B2Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0384US11192775B2Rough layer for better anti-stiction depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 7, 2021·2 cites·20 claims
- 0482US9884755B2Rough anti-stiction layer for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 6, 2018·2 cites·20 claims
- 0581US10361449B2Semiconductor structures having a micro-battery and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 23, 2019·1 cites·20 claims
- 0679US11695150B2Semiconductor structures having a micro-battery and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 0779US10173886B2Rough anti-stiction layer for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 8, 2019·1 cites·20 claims
- 0879US9123754B2Bonding alignment tool and methodSHIH YUN-TAI·Filed 2011·Granted Sep 1, 2015·6 cites·20 claims
- 0979US2025187907A1Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1077US9725312B1Preconditioning to enhance hydrophilic fusion bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 8, 2017·3 cites·20 claims
- 1175US11772963B2Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1275US11101491B2Semiconductor structures having a micro-battery and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·0 cites·20 claims
- 1374US9240611B2Semiconductor structures having a micro-battery and methods for making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 19, 2016·1 cites·20 claims
- 1473US12466727B2Extended acid etch for oxide removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 1570US11862482B2Semiconductor substrate bonding tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·8 claims
- 1670US10273141B2Rough layer for better anti-stiction depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·1 cites·20 claims
- 1769US11721662B2Wafer bonding method and wafer bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·20 claims
- 1868US10626010B2Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·20 claims
- 1967US9444398B2Semiconductor structure and fabricating process for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 13, 2016·2 cites·15 claims
- 2065US12243848B2Methods and systems for improving fusion bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 2165US10759654B2Rough anti-stiction layer for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·20 claims
- 2265US9481567B2MEMS structure, cap substrate and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 1, 2016·1 cites·19 claims
- 2364US11655146B2Extended acid etch for oxide removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 2463US11192778B2MEMS package with roughend interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·20 claims
- 2562US10847490B2Bonding alignment toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
- 2660US2025174595A1Methods and systems for improving fusion bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2754US10710872B2MEMS package with roughend interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 14, 2020·0 cites·20 claims
- 2851US10396054B2Bonding alignment toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 27, 2019·0 cites·20 claims
- 2948US10112826B2Method for forming micro-electro-mechanical system (MEMS) device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 30, 2018·0 cites·20 claims
- 3047US9230918B1Semiconductor package structure, alignment structure, and alignment methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 5, 2016·0 cites·20 claims
- 3146US8378490B2Semiconductor apparatus including a metal alloy between a first contact and a second contactTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Feb 19, 2013·0 cites·20 claims
- 3244US11211354B2Systems and methods for semi-flexible eutectic bonder piece arranegmentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 28, 2021·0 cites·20 claims
- 3341US9368390B2Semiconductor apparatusNI CHYI-TSONG·Filed 2013·Granted Jun 14, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →