Inventor · disambiguated record
Ichiharu Kondo
Also filed as: KONDO ICHIHARU
10 granted patents·2 pending applications·395 citations·filing 1992–2005
91Inventor score
Top patents by PatentIndex Score
12 records- 0196US5656858ASemiconductor device with bump structureNIPPON DENSO CO·Filed 1995·Granted Aug 12, 1997·279 cites·18 claims
- 0275US7168326B2Compact pressure sensor with high corrosion resistance and high accuracyDENSO CORP·Filed 2005·Granted Jan 30, 2007·4 cites·20 claims
- 0369US6548386B1Method for forming and patterning filmDENSO CORP·Filed 2000·Granted Apr 15, 2003·19 cites·48 claims
- 0468US7176541B2Pressure sensorDENSO CORP·Filed 2005·Granted Feb 13, 2007·7 cites·12 claims
- 0563US5635764ASurface treated structure for solder jointNIPPON DENSO CO·Filed 1993·Granted Jun 3, 1997·32 cites·19 claims
- 0662US7030496B2Semiconductor device having aluminum and metal electrodes and method for manufacturing the sameDENSO CORP·Filed 2004·Granted Apr 18, 2006·13 cites·16 claims
- 0761US5360765AMethod of forming electrodes of semiconductor deviceNIPPON DENSO CO·Filed 1992·Granted Nov 1, 1994·20 cites·19 claims
- 0855US7242065B2Compact pressure sensor with high corrosion resistance and high accuracyDENSO CORP·Filed 2005·Granted Jul 10, 2007·3 cites·12 claims
- 0944US5876861ASputter-deposited nickel layerNIPPON DENSO CO·Filed 1996·Granted Mar 2, 1999·9 cites·11 claims
- 1038US2006081996A1Semiconductor device having aluminum electrode and metallic electrodeDENSO CORP·Filed 2005·Application pending·0 cites
- 1135US5614291ASemiconductor device and method of manufacturing the sameNIPPON DENSO CO·Filed 1995·Granted Mar 25, 1997·9 cites·25 claims
- 1234US2005034526A1Semiconductor sensor and method of plating semiconductor devicesDENSO CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →