Inventor · disambiguated record
Ichiroh Sawamura
Also filed as: SAWAMURA ICHIROH
3 granted patents·245 citations·filing 1985–2002
75Inventor score
Top patents by PatentIndex Score
3 records- 0194US5693203ASputtering target assembly having solid-phase bonded interfaceJAPAN ENERGY CORP·Filed 1994·Granted Dec 2, 1997·219 cites·3 claims
- 0279US7138040B2Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anodeNIPPON MINING CO·Filed 2002·Granted Nov 21, 2006·12 cites·14 claims
- 0366US4675055AMethod of producing Ti alloy platesNIPPON KOKAN KK·Filed 1985·Granted Jun 23, 1987·14 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →