Inventor · disambiguated record
Igor Elkanovich
Also filed as: ELKANOVICH IGOR
23 granted patents·5 pending applications·44 citations·filing 2006–2025
92Inventor score
Top patents by PatentIndex Score
28 records- 0194US11411560B1Electronic system, integrated circuit die and operation method thereofGLOBAL UNICHIP CORP·Filed 2021·Granted Aug 9, 2022·5 cites·35 claims
- 0292US11063596B1Frame decoding circuit and method for performing frame decodingGLOBAL UNICHIP CORP·Filed 2021·Granted Jul 13, 2021·4 cites·26 claims
- 0388US11336427B1Circuit of communication interface between two dies and method to manage communication interfaceGLOBAL UNICHIP CORP·Filed 2021·Granted May 17, 2022·3 cites·24 claims
- 0487US11474554B2Circuit for providing clock to de-serializer in communication physical layerGLOBAL UNICHIP CORP·Filed 2021·Granted Oct 18, 2022·3 cites·18 claims
- 0587US11031923B1Interface device and interface method for 3D semiconductor deviceGLOBAL UNICHIP CORP·Filed 2020·Granted Jun 8, 2021·2 cites·20 claims
- 0683US7925156B2Apparatus and method for measuring the quality of burst signals and performing optical line diagnosticsBROADLIGHT LTD·Filed 2007·Granted Apr 12, 2011·11 cites·9 claims
- 0782US8243869B2Burst mode clock and data recovery circuit and methodDVIR AMIAD·Filed 2006·Granted Aug 14, 2012·11 cites·26 claims
- 0877US11515278B2Communication interface structure between processing die and memory dieGLOBAL UNICHIP CORP·Filed 2021·Granted Nov 29, 2022·1 cites·10 claims
- 0975US12292850B2Communication system between dies and operation method thereofGLOBAL UNICHIP CORP·Filed 2023·Granted May 6, 2025·0 cites·13 claims
- 1075US2025225101A1Communication system between dies and operation method thereofGLOBAL UNICHIP CORP·Filed 2025·Application pending·0 cites
- 1175US2025225100A1Communication system between dies and operation method thereofGLOBAL UNICHIP CORP·Filed 2025·Application pending·0 cites
- 1272US8451864B2Passive optical network processor with a programmable data pathSITTON GAL·Filed 2010·Granted May 28, 2013·4 cites·20 claims
- 1360US2025279396A1Semiconductor device and method of arranging an interface of a semiconductor deviceGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 1456US12438654B2Communication system between dies and repairing method for lanes between diesGLOBAL UNICHIP CORP·Filed 2023·Granted Oct 7, 2025·0 cites·24 claims
- 1554US12093202B2DBI encoding device and DBI encoding methodGLOBAL UNICHIP CORP·Filed 2022·Granted Sep 17, 2024·0 cites·18 claims
- 1653US12066968B2Communication interface structure and Die-to-Die packageGLOBAL UNICHIP CORP·Filed 2022·Granted Aug 20, 2024·0 cites·18 claims
- 1753US11144485B1Interface for semiconductor device with symmetric bond pattern and method for arranging interface thereofGLOBAL UNICHIP CORP·Filed 2020·Granted Oct 12, 2021·0 cites·26 claims
- 1852US2024014174A1Interface for a semiconductor chip with adaptive via region arrangement and semiconductor device with stacked semiconductor chipsGLOBAL UNICHIP CORP·Filed 2022·Application pending·0 cites
- 1951US11687472B2Interface for semiconductor device and interfacing method thereofGLOBAL UNICHIP CORP·Filed 2020·Granted Jun 27, 2023·0 cites·22 claims
- 2050US12117864B2Interface device and signal transceiving method thereofGLOBAL UNICHIP CORP·Filed 2022·Granted Oct 15, 2024·0 cites·17 claims
- 2150US11699683B2Semiconductor device in 3D stack with communication interface and managing method thereofGLOBAL UNICHIP CORP·Filed 2020·Granted Jul 11, 2023·0 cites·16 claims
- 2249US12235717B2Communication system between dies and operation method thereofGLOBAL UNICHIP CORP·Filed 2022·Granted Feb 25, 2025·0 cites·16 claims
- 2349US11675731B2Data protection system and method thereof for 3D semiconductor deviceGLOBAL UNICHIP CORP·Filed 2020·Granted Jun 13, 2023·0 cites·20 claims
- 2448US11742295B2Interface of integrated circuit die and method for arranging interface thereofGLOBAL UNICHIP CORP·Filed 2020·Granted Aug 29, 2023·0 cites·18 claims
- 2544US12283957B2Interface device and signal transceiving method thereofGLOBAL UNICHIP CORP·Filed 2022·Granted Apr 22, 2025·0 cites·18 claims
- 2644US11600572B2Routing structure between dies and method for arranging routing between diesGLOBAL UNICHIP CORP·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 2742US11902171B2Communication system between dies and operation method thereofGLOBAL UNICHIP CORP·Filed 2021·Granted Feb 13, 2024·0 cites·19 claims
- 2837US2007116466A1Optical network unit (ONU) circuitBROADLIGHT LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →