Inventor · disambiguated record
Iho Kamimura
Also filed as: KAMIMURA IHO
1 granted patent·1 pending application·0 citations·filing 2013–2021
5Inventor score
Files withMITSUBISHI CHEM CORP2
Top patents by PatentIndex Score
2 records- 0154US2022041856A1Epoxy resin composition, curable resin composition, cured product, and adhesiveMITSUBISHI CHEM CORP·Filed 2021·Application pending·0 cites
- 0248US9960092B2Interlayer filler composition for three-dimensional integrated circuitMITSUBISHI CHEM CORP·Filed 2013·Granted May 1, 2018·0 cites·34 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →