Inventor · disambiguated record
Ii Young Park
Also filed as: PARK II YOUNG
1 granted patent·1 pending application·29 citations·filing 2002–2023
44Inventor score
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2 records- 0179US6759714B2Semiconductor device having heat release structure using SOI substrate and fabrication method thereofKOREA ELECTRONICS TELECOMM·Filed 2002·Granted Jul 6, 2004·29 cites·16 claims
- 0255US2025109897A1Compression system and clothing treatment device including sameLG ELECTRONICS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →