Inventor · disambiguated record
Iji Onozuka
Also filed as: ONOZUKA IJI
3 granted patents·5 pending applications·4 citations·filing 2004–2018
54Inventor score
Top patents by PatentIndex Score
8 records- 0164US8871660B2Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated bodyYOSHIZAKI KAZUYUKI·Filed 2008·Granted Oct 28, 2014·3 cites·19 claims
- 0263US11571549B2Medical deviceSUMITOMO BAKELITE CO·Filed 2018·Granted Feb 7, 2023·1 cites·28 claims
- 0340US11577050B2Medical deviceSUMITOMO BAKELITE CO·Filed 2018·Granted Feb 14, 2023·0 cites·36 claims
- 0434US2020171276A1CatheterSUMITOMO BAKELITE CO·Filed 2018·Application pending·0 cites
- 0534US2009166060A1Insulating Resin Layer, Insulating Resin Layer With Carrier And Multiple-Layered Printed Wiring BoardONOZUKA IJI·Filed 2006·Application pending·0 cites
- 0632US2013242520A1Insulating substrate, metal-clad laminate, printed wiring board and semiconductor deviceONOZUKA IJI·Filed 2011·Application pending·0 cites
- 0731US2011308848A1Resin composition for wiring board, resin sheet for wiring board, composite body, method for producing composite body, and semiconductor deviceITO YUKA·Filed 2010·Application pending·0 cites
- 0831US2004148766A1Multi-layer circuit board and method for manufacturing sameFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →