Inventor · disambiguated record
Ik-Seong Park
Also filed as: PARK IK-SEONG
8 granted patents·5 pending applications·113 citations·filing 1999–2019
84Inventor score
Top patents by PatentIndex Score
13 records- 0183US6492200B1Semiconductor chip package and fabrication method thereofHYUNDAI ELECTRONICS IND CO INC·Filed 1999·Granted Dec 10, 2002·85 cites·37 claims
- 0281US7598101B2LED of side view type and the method for manufacturing the sameALTI ELECTRONICS CO LTD·Filed 2007·Granted Oct 6, 2009·9 cites·10 claims
- 0363US11291113B2Ceramic substrate and manufacturing method thereforAMOSENSE CO LTD·Filed 2017·Granted Mar 29, 2022·1 cites·16 claims
- 0457USD549187SLight emitting diode (LED) packageALTI ELECTRONICS CO LTD·Filed 2006·Granted Aug 21, 2007·11 cites·1 claims
- 0552US2010019267A1Led of side view type and the method for manufacturing the sameALTI ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 0646US11355419B2Power semiconductor moduleAMOSENSE CO LTD·Filed 2019·Granted Jun 7, 2022·0 cites·11 claims
- 0745US2009189175A1Side view type light emitting diode packageALTI ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0840US11355355B2Method for producing ceramic substrate, and ceramic substrateAMOSENSE CO LTD·Filed 2018·Granted Jun 7, 2022·0 cites·1 claims
- 0940USD570799SSide view type light emitting diodeALTI ELECTRONICS CO LTD·Filed 2007·Granted Jun 10, 2008·4 cites·1 claims
- 1040US2007246729A1High efficiency LED packagePARK IK-SEONG·Filed 2007·Application pending·0 cites
- 1137USD596147SLight emitting diodeALTI ELECTRONICS CO LTD·Filed 2008·Granted Jul 14, 2009·3 cites·1 claims
- 1235US2011242797A1Backlight unit and method for manufacturing the samePARK IK-SEONG·Filed 2010·Application pending·0 cites
- 1329US2019096696A1Method for filling via hole of ceramic substrate and ceramic substrate via hole filler formed therebyAMOSENSE CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →