Inventor · disambiguated record
Ikuo Shohji
Also filed as: SHOHJI IKUO
4 granted patents·1 pending application·36 citations·filing 2000–2015
70Inventor score
Top patents by PatentIndex Score
5 records- 0180US6569262B1Lead-free solder powder material, lead-free solder paste and a method for preparing sameIBM·Filed 2000·Granted May 27, 2003·28 cites·6 claims
- 0260US9572252B2Wiring substrate and method of manufacturing wiring substrateTOPPAN PRINTING CO LTD·Filed 2014·Granted Feb 14, 2017·0 cites·6 claims
- 0358US7172643B2Lead-free solder powder material, lead-free solder paste and a method for preparing sameIBM·Filed 2003·Granted Feb 6, 2007·8 cites·8 claims
- 0436US2016332262A1Flux for soldering and solder compositionFUJI ELECTRIC CO LTD·Filed 2015·Application pending·0 cites
- 0531US9883586B2Wiring substrate for bonding using solder having a low melting point and method for manufacturing sameTOPPAN PRINTING CO LTD·Filed 2015·Granted Jan 30, 2018·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →