Inventor · disambiguated record
Ill-Heung Choi
Also filed as: CHOI ILL HEUNG
12 granted patents·3 pending applications·307 citations·filing 2001–2013
92Inventor score
Technology areasH10W
Top patents by PatentIndex Score
15 records- 0194US6864566B2Duel die packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 8, 2005·112 cites·4 claims
- 0290US6724074B2Stack semiconductor chip package and lead frameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 20, 2004·66 cites·27 claims
- 0388US6781240B2Semiconductor package with semiconductor chips stacked therein and method of making the packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 24, 2004·46 cites·10 claims
- 0487US6445077B1Semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 3, 2002·45 cites·16 claims
- 0580US8638037B2Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device packageMOON KYUNG-MI·Filed 2011·Granted Jan 28, 2014·5 cites·39 claims
- 0678US8840265B2Illumination apparatus employing light-emitting device packageMOON KYUNG-MI·Filed 2011·Granted Sep 23, 2014·5 cites·19 claims
- 0772US8455889B2Lead frame for chip package, chip package, package module, and illumination apparatus including chip package moduleLEE YOUNG-JIN·Filed 2011·Granted Jun 4, 2013·3 cites·61 claims
- 0867US6825511B2Semiconductor device having fuse circuit on cell region and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 30, 2004·10 cites·38 claims
- 0963US9099332B2Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 4, 2015·1 cites·20 claims
- 1061US7115441B2Semiconductor package with semiconductor chips stacked therein and method of making the packageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 3, 2006·9 cites·8 claims
- 1152US2008160682A1Semiconductor device having fuse circuit on cell region and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1251US7368330B2Semiconductor device having fuse circuit on cell region and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 6, 2008·3 cites·11 claims
- 1347US6855575B2Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Feb 15, 2005·2 cites·7 claims
- 1440US2013092962A1Light emitting device (led), manufacturing method thereof, and led module using the samePAEK HO SUN·Filed 2012·Application pending·0 cites
- 1536US2002084519A1Semiconductor chip stack package and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ill-Heung Choi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →